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Method for Improving Thermal Stability of Josephson Junction

IP.com Disclosure Number: IPCOM000068814D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Murakami, M [+details]

Abstract

One likely cause of failure of Josephson junctions during thermal cyclings is the relaxation of thermal strain which is introduced into the thin film electrodes of the junctions because of the thermal contraction difference between the substrates and the films. The strain relaxation mechanisms are believed to be due to dislocation slip upon cooling and grain boundary diffusional creep upon heating.