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Planar Wiring Repair Technique for the Thin Film Metal Package Via Solder Evaporation

IP.com Disclosure Number: IPCOM000068822D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ho, CW Ting, CY [+details]

Abstract

Wiring repair and engineering changes in multichip packaging can be facilitated by providing a test pad section with each test pad having an engineering change (EC) pad next to it. The EC pads in turn are selectively connected to EC wiring at broken wire segments in the shape of small split circles suitable for joining by metal evaporation. The figure shows the test pad, EC pad and connection regions.