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Liquid Cooling of Integrated Circuit Chips

IP.com Disclosure Number: IPCOM000068827D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Anacker, W [+details]

Abstract

Liquid cooling of integrated circuit chips is limited by the critical power density of coolants to avoid thermal runaway. To reduce power density for given power dissipation the solid-liquid interface area can be increased.