Plating Base Process for NiFe Plated Bubble Devices
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20
In the fabrication of magnetic bubble domain devices, using either double masking levels or single masking levels, it is often necessary to plate permalloy (NiFe) over uneven surfaces. That is, plating must occur over steps where the walls of the steps are not always tapered. Fig. 1 illustrates a structure in which the walls 10 of the step are tapered, while Fig. 2 illustrates a structure in which the walls 10 of the step are not tapered. Previously, it was required to have tapered walls on the steps in order to evaporate a continuous plating base.