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Plating Base for NiFe in Bubble Structures

IP.com Disclosure Number: IPCOM000068846D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ahn, KY Powers, JV [+details]

Abstract

In the fabrication of magnetic bubble domain devices, it is often necessary to have a gold conductor beneath an overlying layer of permalloy (NiFe), where the permalloy is used to move magnetic bubble domains. However, when NiFe is plated onto Au layers, its coercivity (H(c)) is often high.