Browse Prior Art Database

Thermosetting Material used to Control Impedance of Overflowing Wiring

IP.com Disclosure Number: IPCOM000068878D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Pitarra, JJ Sondej, WR [+details]

Abstract

The use of foam material to control the impedance of discrete wires attached to a printed-circuit board has been previously proposed. See, for example, IBM Technical Disclosure Bulletin 18, 2842 (February 1976).