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Thermosetting Material used to Control Impedance of Overflowing Wiring Disclosure Number: IPCOM000068878D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Pitarra, JJ Sondej, WR [+details]


The use of foam material to control the impedance of discrete wires attached to a printed-circuit board has been previously proposed. See, for example, IBM Technical Disclosure Bulletin 18, 2842 (February 1976).