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Flexible Epoxy Material for Sealing Integrated Circuit Packages

IP.com Disclosure Number: IPCOM000068881D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Darrow, RE Memis, I Poliak, RM [+details]

Abstract

The following formulation provides a flexible epoxy material which is suitable for sealing electronic packages. The material has a relatively long reversion life, and it has good ability to withstand thermal cycling without cracking. Two formulas for fabricating this material are given below: COMPONENT FORMULA A FORMULA B Bisphenyl A Resin* 59% 53% Hexahydrophtalic Anhydride Hardener 39% 45% Dye - Polychlorocopper 2% 2% Phthalocyanine/Titanium Dioxide *Resins of the type (Diglycidyl ether of Bisphenyl A) having an epoxy equivalent weight of 180-210 are applicable in the viscosity range of 4000 to 22,500 cps at 25 Degrees C.