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Planarization Process Using a Plasma Etch

IP.com Disclosure Number: IPCOM000068899D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Clark, HA Gati, GS [+details]

Abstract

Sputtered quartz is frequently used as a material for insulating layers between layers of metal interconnections in integrated circuit manufacturing. Unfortunately, the quartz follows the contours of the underlying substrate, covering it with a thickness that is the same whether occurring over the semiconductor/insulator surface or over the metallurgy that projects well above the other surfaces. The resulting height differences make it difficult to properly process and pattern subsequent layers of insulators and metallurgies. Some of the difficulties have been circumvented by the use of the so-called planar quartz process. However, even when using planar quartz there are still some projections, usually referred to as peaks, to be found on the quartz surface that occur over metal lines.