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Integrated Circuit Module Package Cooling Structure

IP.com Disclosure Number: IPCOM000068903D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Pascuzzo, AL Yacavonis, RA [+details]

Abstract

With increasing high density integrated circuit structures, the problem of heat dissipation has become a significant problem not only at the integrated circuit chip level but even at the integrated circuit module level. The present structure provides a method of cooling a plurality of modules 10, shown in the figure, mounted on a supporting board 11 by conventional connectors 12. The structure provides for uniform cooling of the module by cooling means which apply a uniform minimal structural pressure on the modules which will not damage the modules. This is in contrast to conventional module cooling methods which bolt a cold plate against a plurality of module covers or module cans in order to ensure the intimate contact required at the cooling or heat transfer interface between the cold plate and the module.