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This substrate utilizes both thick and thin metallurgy to obtain their respective advantages.
English (United States)
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Semiconductor Package Substrate
This substrate utilizes both thick and thin metallurgy to obtain their
Low temperature thick film metallizing seems limited to under 6,000 psi
adhesion. However, brazed pins require at least 15,000 psi adhesion in order to
withstand the stresses imposed during normal usage. This requirement imposes
a severe limit for high conductivity substrates, such as glass/ceramic, which are
fired under 1,000 Degrees C.
In this substrate thin film metallizing is utilized in nonregistration critical areas
after areas of thick film metallurgy have been fired. Thick film metallurgy, which
provides high adhesion, is provided in areas such as flange rings, and areas for
adhering pins. Thin film metallurgy is provided in other areas where high
accuracy registration is required without the high adhesion requirement.