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Semiconductor Encapsulation

IP.com Disclosure Number: IPCOM000068906D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Magdo, S [+details]

Abstract

Shown is a semiconductor package in which a circuit chip is hermetically sealed to a module substrate by means of a silicon spacer and a silicon cover plate via lead-tin solder joints.