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Applying Radiant Heat to Semiconductor Integrated Circuits

IP.com Disclosure Number: IPCOM000068908D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Lever, RF [+details]

Abstract

In the fabrication of integrated circuits, one technique of joining integrated circuit chips 10 to a chip carrier, which is a ceramic substrate 11, is by the reflow of solder pads 12 which join the chip to selected positions on conductive lands on substrate 11. This solder reflow joining technique is customarily carried out after the chip has been placed on the substrate 11 by applying sufficient heat to the pads, 12 of solder or equivalent fusible conductive material to melt the pads, thus reflowing the same to cause the desired fusion of the chip to the substrate. One convenient means of heating the structure is through the application of infrared radiation 13 from an infrared source, such as a heat lamp 16, onto the back side of the chip 10.