Method and Apparatus for Depositing Resists
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20
Shown is an apparatus for applying resist material onto semiconductor wafers comprising a movable plate capable of rotating in the direction A and carrying a plurality of planets mounted therewith, the planets being capable of rotating in the direction B. The semiconductor wafers are carried on the planets and individually are capable of rotation in the direction C. Positioned above the wafers is at least one spray head for depositing resist onto the surface of the wafers. A chamber surrounds the spray heat and the plate so as to contain the resist within the chamber. If desired, the chamber may be evacuated or pressurized with a carrier atmosphere, such as nitrogen or argon. Beneath the plate is deposed a heating means, such as resistance heat coils, for baking the resist onto the wafers.