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Solder Joint Test Vehicle

IP.com Disclosure Number: IPCOM000068912D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Fouts, DP Jaspal, JS [+details]

Abstract

During the stress testing of solder joints on semiconductor chips it is required that the chip be removed from the substrate to determine whether the failure has occurred from the chip ball limiting metallurgy (BLM) to the solder or from the substrate BLM to the solder. The present test structure eliminates the need for such removal.