Browse Prior Art Database

Resilient Thermal Coupler for Semiconductor Chips

IP.com Disclosure Number: IPCOM000068916D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ecker, M Hwang, UP Metreaud, CG [+details]

Abstract

This article describes a coupling structure between one or more semiconductor chips and a protective enclosure to greatly improve the removal of dissipated heat.