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Resilient Thermal Coupler for Semiconductor Chips Disclosure Number: IPCOM000068916D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Ecker, M Hwang, UP Metreaud, CG [+details]


This article describes a coupling structure between one or more semiconductor chips and a protective enclosure to greatly improve the removal of dissipated heat.