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Monitoring Heavy Metal Contamination in Semiconductor Processing Systems

IP.com Disclosure Number: IPCOM000068961D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Beyer, KD [+details]

Abstract

Metallic contamination contributes to yield losses in bipolar and FET processing. Such contamination in a semiconductor processing system can originate from the presence of metallic impurities in, for example, furnaces, epitaxial reactors, pyrolytic deposition systems, ion implant machines and cleaning stations used for etching and photoresist operations. In order to decrease contamination in a processing line, the contamination level should be monitored at every semiconductor processing step. For monitoring applications, the "state" of the contamination monitor must be measured before and after insertion into the semiconductor processing system.