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All Purpose Chip Carrier Disclosure Number: IPCOM000068963D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

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Follette, DT [+details]


A single chip carrier (module) for high density chips is proposed that can be used with air or liquid-cooled cold plates by only changing the size of its molybdenum stud.