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A single chip carrier (module) for high density chips is proposed that can be used with air or liquid-cooled cold plates by only changing the size of its molybdenum stud.
English (United States)
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All Purpose Chip Carrier
A single chip carrier (module) for high density chips is proposed that can be
used with air or liquid-cooled cold plates by only changing the size of its
The molybdenum stud 13 is shown reflow-soldered at 1 to the cold plate.
The chip 7 is brazed to the molybdenum stud with a gold-silicon preform 11.
Likewise, the molybdenum stud 13 is brazed to the ceramic carrier with gold-
silicon preform 11. The lead frame type connection from the chip carrier to the
board gives the attached cold plate embodiment the necessary flexibility to
withstand thermal expansion and contraction. The cupped TEFLON* sleeve 14
contains and controls the molten solder 1 during cold plate attachment or
detachment. There are no air gaps required nor contact resistance problems
between the molybdenum stud 13 and the cold plate and the molybdenum stud.
The thermal conduction both the cold plate and the molybdenum stud. The
thermal conduction path from the chip 7 to the cooling fluid in the cold plate is
reliable and gives a low thermal resistance.
The heat transfer can be improved by lowering the temperature of the cooling
water in the cold plate and/or changing from water to a low freezing point fluid,
such as methylene chloride, when fluid temperature below zero degrees
centigrade is required. Minimization of temperature skew between
communicating chips is obtainable by appropriate choice of heater coil 12
resistance, thermistor 2 characteristics and...