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Solderless Connection Method

IP.com Disclosure Number: IPCOM000068998D
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Lissner, RW [+details]

Abstract

By applying pressure directly to the leads of solid-state devices by a suitable pressure cap, the cost of effecting connections in printed-circuit boards is reduced, and damage to solid-state devices by high soldering temperatures is eliminated.