System Mechanism for Analysis of Sputtered Films
Original Publication Date: 1978-Mar-01
Included in the Prior Art Database: 2005-Feb-20
This article describes a transport mechanism 1 in a vacuum chamber 2 that moves a wafer 3 from a sputtering position on the face of an anode or cathode to other positions in the same chamber where analytical procedures or subsequent process procedures can be carried out. For example, in a bias sputtering system for fabricating thin films, a test wafer can be moved from a position close to the process wafers to an electron spectrometer for in-process monitoring of the film composition.