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This tool allows removal of soldered modules from boards or cards with a minimal of debris being produced and no unsoldering required.
English (United States)
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Module Removal Tool
This tool allows removal of soldered modules from boards or cards with a
minimal of debris being produced and no unsoldering required.
As shown, a notched blade is engaged into the module pins. The tool face is
butted against the module side, and upon movement of the actuator arm to the
tool upright member, the slide moves in the reverse direction of the actuator arm
and causes the blade to retract into the tool face. A force is created between the
module side and the pins, causing the pins to be sheared. The pins are sheared
one row at a time. The minimum debris created with this technique allows
submodule inspection for such tasks as failure analysis. Also, it eliminates
unsoldering which can change submodule features.
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