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Coating Bond Strength Test Method

IP.com Disclosure Number: IPCOM000069095D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Engel, PA Roshon, DD Thorne, DA [+details]

Abstract

In the manufacture of circuit boards using photosensitive dielectric or other coatings, a need exists for a method of checking the bond strength of the coating. It is particularly essential to detect boards with poor adhesion early in the process before they have undergone many expensive operations. The so-called "knife test" has been used for this purpose. It involves making a cut in the board surface with a sharp knife and looking for evidence of delamination. This test is effective, but it is destructive and not well adapted to production line quality control.