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Universal Test Site Design for Process End Point Detection

IP.com Disclosure Number: IPCOM000069106D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Galicki, A Hayunga, P Sarkary, H [+details]

Abstract

A test site design gives precise control of laser thickness monitoring of quartz deposition and metal etch end-point detection by providing noise-free signals. The test site is made blank except for a blanket layer of platinum silicide at one chip site located at the center of the wafer.