Browse Prior Art Database

Conduction Cooling Module

IP.com Disclosure Number: IPCOM000069112D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Hwang, P Oktay, S Pascuzzo, AL Wong, AC [+details]

Abstract

The drawing shows semiconductor devices 1 electrically and physically mounted on modules 2. The semiconductor devices 1 are cooled by spring-loaded heat-conducting pistons 3. The pistons are seated in the module housing 4. The pistons 3 are cooled by an attached cold plate 5 which has circulating water therethrough. The spring-loaded pistons 3 may be crowned, as shown, or be substantially flat. The crown surface of the piston tip provides the assurance of a satisfactory contact between the crowned, as shown, or be substantially flat. The crown surface of the piston tip provides the assurance of a satisfactory contact between the backside of the semiconductor device 1 to the piston 3.