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Liquid Cooling of a Multichip Module Package

IP.com Disclosure Number: IPCOM000069113D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Balderes, D Lynch, JR [+details]

Abstract

When a plurality of integrated circuit chips 10 are mounted on a standard substrate 11 to produce a multichip integrated circuit package, it is also desirable to cool each of the chip members individually through the back side of the chip by the application of some type of cooling member. However, since in an array of chips, not all of the chips are exactly at the same level, the cooling member has to make a flexible or deformable thermal contact with the back side of the chip. The present structure provides the means for uniform flexible thermal contacts with a plurality of chips arranged in an array.