Browse Prior Art Database

Flexible Thermal Conductor for Electronic Module

IP.com Disclosure Number: IPCOM000069117D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Durand, RD Hwang, UP Oktay, S Wong, AC [+details]

Abstract

A flexible structure 10 (Figs. 1 and 2) between one or more semiconductor chips 11 and their protective enclosure 12 improves chip power handling capability. The semiconductor chip 11 is reflow joined to an insulative substrate 13 using solder joints 14. The top surface of the chip has enough thickness of silicon dioxide 15 so that the chip 11 is electrically isolated from the ambient. The surface on top of this layer 15 is metallized to be ready for soldering to the flexible element.