Browse Prior Art Database

Integral Edge Connector

IP.com Disclosure Number: IPCOM000069118D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Hardin, PW [+details]

Abstract

A concept of multilayer ceramic (MLC) packaging involves mounting about three MLC substrates (modules) in a framework structure such that a fan (or fans) can be mounted at the end(s) to force air through the assembly, thereby effecting heat transfer. A variation of this theme would be to mount the substrate, suitably capped, "chips out" with the backside populated with heat sink fins or studs extending directly into the air stream.