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Three Dimensional MLC Substrate Integrated Circuit Support Package

IP.com Disclosure Number: IPCOM000069119D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Aichelmann, FJ Jarvela, RA More, FA [+details]

Abstract

With reference to Figs. 1 and 2, the assembly comprises a large number of integrated circuit chips mounted under covers 10 to each of a pair of multilevel ceramic (MLC) substrates 11 sandwiching a cold plate assembly 12. In Fig. 1, the covers 10 mounted on the opposite side of cold plate assembly 12 are not shown. The cold plate assembly is liquid cooled through liquid entering and leaving the cold plate through conduits 13 and 14, respectively.