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This is a dual KERF configuration which does not require a second segment generation in mask fabrication.
English (United States)
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Single Segment Double Kerf Approach for Semiconductor Test Chips
This is a dual KERF configuration which does not require a second segment
generation in mask fabrication.
Other test chip designs use a single KERF in spite of the real estate and pad
limitation constraints. A second KERF is usually discouraged on two grounds.
First, it calls for a second segment in mask fabrication, and, second, it takes up
nondiced real estate on the semiconductor wafer. The presently described
technique avoids the first of the two constraints when a quadrant designed test
site is adopted.
When a chip design does not use the quadrant approach, this technique
overcomes even the second constraint by treating a 2 x 2 chip matrix as one
segment in the mask fabrication. The layout shown in the drawing is a dual
KERF in a 2 x 2 chip matrix. The primary KERF A is designated by slant lines
while the auxiliary KERF B is designated by cross-hatching. Note that only the
right-most column auxiliary KERF and the bottom row auxiliary KERF are
inoperative. Such a dual KERF approach can have common primary KERF
between product and test chips, and auxiliary KERF only in test chips, with the
latter stepped in a minimum 2 x 2 matrix in a wafer location.
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