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Temperature Triggerable Fluid Coupling System for Cooling Semiconductor Dies Disclosure Number: IPCOM000069139D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Dorler, JA Ecker, ME [+details]


This article describes an arrangement which includes a sealed chamber containing a liquid metal where a surface of the chamber is compliant, a means whereby the compliant surface may be caused to engage or disengage from specified areas of contact as a function of chip ambient temperature, a chamber whose compliant surface has affixed to it a disc of sintered diamond so as to effect a path of high thermal conductivity as well as electrical isolation, and a structure adaptable to single or multiple semiconductor device cooling.