Browse Prior Art Database

Modified Bellows Conductive Cooling

IP.com Disclosure Number: IPCOM000069141D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Greer, SE Roush, WB [+details]

Abstract

Shown are conductive cooling schemes for semiconductor package structures. They employ the use of a seamless, pleated bellows to remove heat from the backs of flip-chip mounted silicon chips. These bellows are available commercially, and can be modified to meet specific cooling needs. The contact force exerted on the chip can be controlled through a vernier mounted within the bellows (Fig. 1). The bellows can be hermetically sealed to the cap by solder or braze joints. Also, note that the bellows configuration can adjust for chips that are not perfectly horizontal by flexing sideways.