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Optical Determination of Wafer Warpage

IP.com Disclosure Number: IPCOM000069154D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Cooper, R Dupnock, A Forrester, T Orner, C Seirmarco, JA [+details]

Abstract

Measurement of wafer warpage after hot processing operations can be done by optical focusing of a pattern on the surface. The displacement to focus is the warpage at that point on the surface, and is directly read on a micrometer gauge.