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Chip Module (Board) Package for High Speed Computer Technology Disclosure Number: IPCOM000069271D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Braslau, N [+details]


Improvements in semiconductor chip packaging can be achieved and demounting facilitated where alignment pins are employed to position a stacked assembly and to position a peripheral spring clip for demounting. Electrical properties are improved by alternating signal and ground pads.