Browse Prior Art Database

Chip Module (Board) Package for High Speed Computer Technology

IP.com Disclosure Number: IPCOM000069271D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Braslau, N [+details]

Abstract

Improvements in semiconductor chip packaging can be achieved and demounting facilitated where alignment pins are employed to position a stacked assembly and to position a peripheral spring clip for demounting. Electrical properties are improved by alternating signal and ground pads.