Browse Prior Art Database

Processing of Silicon Wafers

IP.com Disclosure Number: IPCOM000069299D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Sacher, E Woods, JJ [+details]

Abstract

In certain monolithic circuit structures, a silicon wafer has a quartz layer deposited thereon by sputtering, followed by a layer of polyimide. A 1% aqueous solution of adhesive promoter will deposit on bare silicon as well as onto the quartz layer, and will adequately bond the polyimide directly onto the silicon, permitting elimination of the quartz layer and the process step required to deposit it.