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Solder Process Disclosure Number: IPCOM000069300D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Gould, DJ Wild, R [+details]


The cooling direction of a solder heat sink may be controlled to provide a smooth, uniform solder interface at a desired location, even though the normal heat flow from a device would not provide such a surface. In a normal soldering operation, once the heat is removed from the solder process, the cooling direction normally follows the path of the least thermal resistance. This may be undesirable especially in situations where the solder interface is at an internal point and the thermal path is such that the internal point would normally cool last.