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Prepreg Manufacturing Process Disclosure Number: IPCOM000069302D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Haining, FW Herbaugh, DG [+details]


Prepreg for printed-circuit boards with very high pickup (70-80% resin), very low pickup (20-30% resin) and prepreg containing particulate fillers that alter the dielectric constant can be fabricated using a conventional treater of the type manufactured by Egan Corporation.