Browse Prior Art Database

Prepreg Manufacturing Process

IP.com Disclosure Number: IPCOM000069302D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Haining, FW Herbaugh, DG [+details]

Abstract

Prepreg for printed-circuit boards with very high pickup (70-80% resin), very low pickup (20-30% resin) and prepreg containing particulate fillers that alter the dielectric constant can be fabricated using a conventional treater of the type manufactured by Egan Corporation.