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Multilayer Printed Circuit Boards

IP.com Disclosure Number: IPCOM000069304D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Cechanek, R [+details]

Abstract

The conductive layers in a multilayer printed-circuit structure can be interconnected by driving metallic pins as small as .002-.003'' in diameter into the structure. The pins are driven in at a very high velocity, approaching projectile velocities, such that the pins penetrate the structure and create intermetallic bonds which form permanent electrical connections between conductive layers.