Browse Prior Art Database

Insulator System

IP.com Disclosure Number: IPCOM000069317D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Carden, GR McBride, DG [+details]

Abstract

In certain bubble memory packages, the bubble memory chip is sandwiched between two ferromagnetic plates, one of which has a matrix of apertures to allow the terminal pins of the bubble memory module to pass therethrough. This insulator system provides a means for electrically insulating the apertured ferromagnetic plate from the module's terminal pins. It also provides physical blockage seal in the apertures when the exterior backside of the module, which houses the chip, is subsequently sealed with an appropriate sealant.