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High Density Multilayer Ceramic Module

IP.com Disclosure Number: IPCOM000069328D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Crawford, D Druschel, WO Martin, BD Richards, L [+details]

Abstract

Disclosed is multilevel multilayer ceramic (MLC) structure populated with LSI chips by C4 attachment on multiple surfaces (three surfaces shown). Fig. 1 is a sectional top view of the module taken along the line 1-1 of Fig. 2. Fig. 2 is a full sectional view of the module taken along the line 2-2 of Fig. 1. Fig. 3 is an enlarged view of a portion of Fig. 2.