Browse Prior Art Database

Separable Multilevel Thermal Connector

IP.com Disclosure Number: IPCOM000069330D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ecker, ME [+details]

Abstract

Fig. 1B illustrates a possible embodiment of the disclosure. A heating element is embedded in a suitable material, such as polyimide. Eyelets, electro-tin plated on the exterior surface, are placed in holes punched in the heater support member. Flanged spherical cap members are placed over the protruding eyelet and spot welded while clamped together. The embedded heater element is shown extending into the hole region so as to engage an eyelet member. This connection is used to apply an electrical current to the heater element that produces a sufficient temperature rise to reflow the Sn/Pb solder contained in the eyelet.