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To permit fabricating read-only memory semiconductor devices that are flip-chip bonded to a substrate, a method for erasure with ultraviolet (UV) exposure is required.
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Flip Chip Read Only Memory
To permit fabricating read-only memory semiconductor devices that are flip-
chip bonded to a substrate, a method for erasure with ultraviolet (UV) exposure is
In this application the substrate supporting the flip-chip bonded
semiconductor read-only memory is made of a material that is transparent to UV
radiation. This permits UV radiation exposure of the read-only memory devices
through the supporting substrate. Possible materials that are transparent to UV
radiation are (A) Li(2) O-Al(2)O(3)-SiO(2) systems, (B) Al(2)O(3)-SiO(2) systems
with mullite as a major phase, and (C) RO-Al(2)O(3)-SiO(2) systems where R is
Mg and/or Ca, Ba, or Zn.