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Temperature Adjustable Spring Load for Conduction Pistons in a Semiconductor Module Disclosure Number: IPCOM000069338D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Goldmann, LS [+details]


It is often desirable to vary the spring loading on a machine element at different periods of its lifetime. A pertinent case is the thermally conductive semiconductor module package where at low temperature a high spring load imposed on the chip by a spring loaded piston is desirable to withstand shock and the vibration from module assembly, shipping and installation, while at operating temperature a reduced spring load is desirable to prevent damage to a thermally weakened bond. To effect this change when the element is encapsulated in a hermetically sealed package is especially difficult.