Browse Prior Art Database

Temperature Adjustable Spring Load for Conduction Pistons in a Semiconductor Module

IP.com Disclosure Number: IPCOM000069338D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Goldmann, LS [+details]

Abstract

It is often desirable to vary the spring loading on a machine element at different periods of its lifetime. A pertinent case is the thermally conductive semiconductor module package where at low temperature a high spring load imposed on the chip by a spring loaded piston is desirable to withstand shock and the vibration from module assembly, shipping and installation, while at operating temperature a reduced spring load is desirable to prevent damage to a thermally weakened bond. To effect this change when the element is encapsulated in a hermetically sealed package is especially difficult.