Determining the Etching End Point of Photoresist During Reactive Ion Etching
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20
This technique ensures the complete removal of photoresist during a reactive ion etching (RIE) removal process. It also provides for the monitoring and control of overetching so as to avoid ledges or undercut in materials disposed below the resist.