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Planar Lift Off Process

IP.com Disclosure Number: IPCOM000069344D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Brooks, GA Wong, MC [+details]

Abstract

The process described below enables the reduction of the topography of approximately 9500 Angstrom metal lands to about 4500 Angstroms or less. The new topography is much less sharp or steep than the original land patterns.