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Liquid Metal Cooled Integrated Circuit Module Structures

IP.com Disclosure Number: IPCOM000069351D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Berndlmaier, E Clark, BT Dorler, JA [+details]

Abstract

Figs. 1 through 4 respectively, depict (in cross section) portions of a circuit module having a substrate, a semiconductor chip (or chips) connected by C4 connections to lands (not shown) on the substrate. As further illustrated only in Fig. 1, each of the module substrates carries a number of pins, at least certain of which are connected via C4 connections to the integrated circuitry on the chip.