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Electronic Packaging Structure Disclosure Number: IPCOM000069353D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Arnold, AJ Clark, BT Dionne, E Siwy, MJ Woodside, DH [+details]


The structures shown in Figs. 1 and 2 represent a means for obtaining efficient heat transfer from a source of heat generation (an integrated circuit chip) through the interior of a surrounding enclosure and into the confining walls of the enclosure (the lid, frame and substrate base).