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Power Dissipation by Controlling Bubble Size of Liquid Coolant

IP.com Disclosure Number: IPCOM000069354D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Fugardi, JF Gregor, LV [+details]

Abstract

Described herein is a coolant mixture adapted for use in chip cooling systems, such as shown in U. S. Patent 3,741,292.