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Measurement Method for Solder Creep Resolution of Less Than 5 Microns

IP.com Disclosure Number: IPCOM000069355D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Bhattacharya, S Sullivan, EJ [+details]

Abstract

Solder creep measurements in small specimens (of about .015" in diameter) at low stress levels (approximately 30 psi or less) have always been plagued by the experimental problem of maintaining uniform loading without vibration effects and the problem of measurement of small dimensional changes.