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Semiconductor Module Seal Disclosure Number: IPCOM000069375D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Kehagioglou, T [+details]


Some semiconductor packaging modules have ceramic substrates on which are mounted a plurality of semiconductor devices or chips, and it is desired to attach a cap or hat to the module in such a way as to form a hermetic seal. Shown in the drawing is a way to accomplish this.