Browse Prior Art Database

Semiconductor Module Seal

IP.com Disclosure Number: IPCOM000069375D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kehagioglou, T [+details]

Abstract

Some semiconductor packaging modules have ceramic substrates on which are mounted a plurality of semiconductor devices or chips, and it is desired to attach a cap or hat to the module in such a way as to form a hermetic seal. Shown in the drawing is a way to accomplish this.