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This article describes a method and apparatus for producing small precision holes in thin sections of certain glasses and ceramics.
English (United States)
This text was extracted from a PDF file.
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100% of the total text.
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Electropiercing Holes in Glass
This article describes a method and apparatus for producing small precision
holes in thin sections of certain glasses and ceramics.
The method is useful for producing holes in glasses and ceramics which
show mobile cation conductivity at elevated temperatures. The process utilizes a
form of capacitance discharge erosion to produce the holes. The erosion is
accomplished by applying a voltage (2-5 KV, for example) from a source 10
across substrate 12 by electrode 14 while it is being heated until the conditions of
discharge are met. The substrate is preferably mounted spaced from a
conductive base member 16 by, for example, insulating standoffs 18. The
substrate may also be first heated to a predetermined temperature (typically,
300-500 Degrees C), and then have the voltage applied at the level at which
breakdown occurs. The temperature of the substrate during operation of the
method is preferably near the anneal temperature of the glass or ceramic
material. A precision hole is produced opposite electrode 14, the size and shape
of which is determined by the substrate materials and the materials and
geometry of the electrode. One suitable electrode is formed of a platinum-nickel
alloy about 20 mils in diameter and is drawn to a smaller end radius.
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