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Method to Avoid the Polysilicon Film Tearing Mechanism

IP.com Disclosure Number: IPCOM000069432D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Irene, EA [+details]

Abstract

Polysilicon (Poly) is receiving much attention for use as a contact material for many silicon devices. However, the reliability of Poly is questionable.